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  • HOME > Products > Pulse Laser Deposition System

    DE200 PLD Deposition System

    Pulsed laser deposition (PLD) is a physical vapor deposition (PVD) technique where a high-power pulsed laser beam is focused inside a vacuum chamber to strike a target of the material that is to be deposited. This material is vaporized from the target (in a plasma plume) which deposits it as a thin film on a substrate (such as a silicon wafer facing the target). This process can occur in ultra high vacuum or in the presence of a background gas, such as oxygen which is commonly used when depositing oxides to fully oxygenate the deposited films.

    • Features
    • Description

    PLD chamber
    STM chamber
    Load Lock chamber
    Target manipulator
    Sample Manipulator
    Laser source
    Substrate heating or cooling

    • PLD UHV chamber
    • STM UHV chamber
    • UHV Sample manipulator
    • Target stage manipulator
    • Load Lock chamber
       

      Typical PLD System Configuration and Variations

      1. Typical PLD Configuration
      The substrate and target are introduced through a load lock chamber opposite the target gearbox. The substrate is then rotated on its polar axis to face the target gearbox. The substrate can be moved out of the way for transfer of the targets. This is one of the most common and economical configurations.

      Typical PLD configuration, vertically-mounted substrate manipulator

      Typical PLD substrate manipulator with 2" quartz lamp heater

      Typical PLD target manipulator, horizontal mount, STLC target system

      2. Vertical PLD Configuration
      This design features up-facing, gravity-held target holders to accommodate liquid, powder, or conventional targets. A custom transfer fork moves substrates and targets into place via standard load lock chamber.

      3. Simple PLD Configuration
      This design offers basic substrate and target devices with no XY or Z adjustment. Substrate and target changes are done at atmosphere.

      4. Multi-Purpose PLD Configuration
      This design permits MBE growth, via bottom-flange-mounted evaporation sources, as well as PLD growth. Substrate assembly faces the side of the chamber for PLD, the bottom for MBE, and the other side for in-vacuum transfer of substrates.

      PLD Components

      PLD substrate manipulator with 2" quartz lamp heater and gas shower ring.

      We offers an extensive line of substrate and target manipulators as well as load lock and sample transfer systems for PLD systems. Our standard modular components can be configured in a variety of ways to meet your specific PLD system design. We can also design, integrate and certify complete PLD systems.

      Typical Manipulator Specifications


      Orientation Vertical or Horizontal
      X-Y movement ±0.5" or ±1.0"
      Substrate sample size<2" diameter
      Targets 6 - 1" (other configurations available)
      Sample orientation any
      Sample heating SHQ to 1292°F (water-cooled heater)
      Vacuum environment UHV, O2
      In-vacuum sample transfer optional
      Base flange 8"


     

    • Applications
    1. Categories
    2. Magnetron Sputtering System
    3. Electron Beam Evaporator
    4. Thermal Evaporation System
    5. Pulse Laser Deposition System
    6. Combination System
    7. Targets & materials
    8. Components
    1. Applications
    2. Microelectronics (Metals, Metal Oxides, Dielectrics)
    3. Data Storage (Magnetic thin films)
    4. MEMS and Nano Technology
    5. Superconducting Materials
    6. Josephson Junctions
    7. Biomedical Thin Films
    8. Photovoltaics
    9. Optical Films and Photonics
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