DE3000 Multi Chamber Thin Film Deposition System

LOAD LOCK connect sputter and ebeam chamber

Sputter chamber with front open door

Multi sputter cathodes

eGun chamber with front open door

Multi pocket rotate eGun sources

Cryopump and dry pump

Max. 6” substrate

Substrate rotate

Substrate bias (option)

Substrate heating to 1832°F (option)

Up to four process gas

PID sputter pressure control

Manual or automatic system control

Good film uniformity and repeatability

For sputter metal, semiconductor and insulation materials

For deposition of multi-layer and alloy film