• HOME
  • ABOUT
  • PRODUCTS
    • Magnetron Sputtering System
    • Electron Beam Evaporator
    • Thermal Evaporation System
    • Pulse Laser Deposition System
    • Combination System
    • Targets & materials
    • Components
  • APPLICATIONS
  • NEWS
  • CONTACTS
  • HOME > Products > Electron Beam Evaporator

    DE500CH E-beam Evaporation System

    DE500CH Thin Film deposition system is assembled two e-beam evaporation sources for deposition metals, semiconductor, insulation materials (materials depends) on the up to 4 inch substrate, and it is assembled with worldwide well known components, the configuration / specification as per following description


    • Features
    • Description

    Unique Design of Substrate Chamber and Sources chamber isolated by UHV gate valve

    All Metal Seal, True UHV System 

    Stand along system frameworks and electric rack

    E-beam source Water Interlock 

    Optional Substrate Cooling


    The DE500CH Electron Beam Evaporator is assembled with two e-beam sources,  the substrate is mounting on the horizontal axial on the side of chamber for the substrate polar to change the deposition angle.

     

    Configuration

    Evaporation Chamber

    304 stainless steel chamber with viewport

    Vacuum Pumping

    Cryo-pump or Turbo pump and dry rough pump

    Vacuum Valve

    Pneumatic UHV valves

    Evaporation Source

     One rotary six pocket E-BEAM source with 15cc crucibles

     One one pocket E-BEAM source with 15cc crucibles

    Substrate Chamber

    304 stainless steel chamber with viewport

    Sample Stage 

    Top mounted rotary sample stage

    Side mounted tilt and rotary sample stage

    (option heating to 600C)

    (option cooling to -150C)

    Film Control

    Crystal Film thickness Monitor and Control 

    Vacuum Gauging

    Wide range vacuum gauge and rough gauge

    Load Lock Chamber (Option)304 stainless steel chamber of front open door with viewport


    Specification

    The Base Vacuum Pressure

    Better than 9E-8 Torr

    Sample Loading Capacity

    One Max. 4 inch flat substrate

    Rate Resolution

    0.05 Angstroms/sec

    Thickness Resolution = 0.02 Angstroms

    0.02 Angstroms


    Typical Application  


    For R & D Thin Film Deposition 

    Ideal tools for LIFT-OFF process

    Evaporate metal, Semiconductor or Insulation Materials

    Evaporate Magnetic Materials

    Related products

    • DE600C Electron Beam Evaporation system
    • DE400DHL E-beam Evaporation System
    • DE400BHL E-beam Evaporation System
    • DE400CHL E-beam Evaporation System
    • DE400D E-beam Evaporation System
    • DE400 Electron Beam Evaporator
    1. Categories
    2. Magnetron Sputtering System
    3. Electron Beam Evaporator
    4. Thermal Evaporation System
    5. Pulse Laser Deposition System
    6. Combination System
    7. Targets & materials
    8. Components
    1. Applications
    2. Microelectronics (Metals, Metal Oxides, Dielectrics)
    3. Data Storage (Magnetic thin films)
    4. MEMS and Nano Technology
    5. Superconducting Materials
    6. Josephson Junctions
    7. Biomedical Thin Films
    8. Photovoltaics
    9. Optical Films and Photonics
  • About Contacts News & Events
  • Category Applications
  • Facebook Twitter Email
About US Products Applications Contact US

DE TECHNOLOGY INC. All rights reserved @ 2025