DE500 Magnetron Sputtering System

DE500 Magnetron Sputter are assembled with four sputter sources for sputtering metals, semiconductor and insulation materials on the substrate up to 6” diameter, the sputter chamber base vacuum pressure is 5E-8 Torr, it can be used to sputter alloy film or multi layer film, especially it can be used to sputter very thin film for some typical materials base on the very low sputter pressure, this is the ideal tools for thin film R&D for the university and academy.

Features
Description

Good Film Uniformity and repeatability

Safety interlock for critical components

Advantage:

Vacuum Pressure ≤ 5.0×10-8Torr

Reach 1E-6 Torr<15 mins, reach 5E-7Torr <30mins

Vacuum pressure is 7.5E-2Torr after 100hours from system stop
Working pressure stable: 0.25%

Plasma stable at less 1mTorr Batch film uniformity: +/-5%

Substrate heating to 1832°F

Excellent film adhesion

Configuration

Magnetron Sputter Chamber	D shape, 304 stainless steel chamber with viewport
Vacuum Pumping	Turbo pump (Cryopump) and dry rough pump
Vacuum Valve	Pneumatic operation high vacuum and isolation gate valves Chamber Vent Valve, Rough and Foreline angle valve, and gas valve
Sputtering Sources	Four 4” circle magnetron sputtering sources Each source with Pneumatic shutter The power supply can be DC, pulse DC or RF power supply
Sample Stage	Substrate linear motion, rotating, and the sample heating or water cooling, Up to 6” substrate with Pneumatic substrate shutter
Vacuum Gauging	Wide range vacuum gauge and Pirani rough gauge
Pressure Control	Four Mass flow controller Capacitance manometer for sputter process pressure control
Cooled Water Interlock	There are cooled water flow sensors of interlock to protect sputter sources work properly
Load Lock	Option O2 reactive, RF plasma cleaning, single or multi substrate loading

DE500 Magnetron Sputtering System

Advantage:

Configuration

Related products