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DE600 Magnetron Sputtering System
LOAD LOCK Chamber (option) Chamber with front open door Cryopump and dry pump Up to six magnetron sputter cathode DC, RF or pulse DC power supply Sputter up or down Max. 8” substrate Substrate rotation Substrate bias (option) Substrate heating to 1000C (option) Substrate cooling (option) Up to four channel process gas PID sputter pressure control Manual or automatic system control Good film uniformity and repeatability For sputter metal, semiconductor and insulation materials
LOAD LOCK Chamber (option)
Chamber with front open door
Cryopump and dry pump
Up to six magnetron sputter cathode
DC, RF or pulse DC power supply
Sputter up or down
Max. 8” substrate
Substrate rotation
Substrate bias (option)
Substrate heating to 1832°F (option)
Substrate cooling (option)
Up to four channel process gas
PID sputter pressure control
Manual or automatic system control
Good film uniformity and repeatability
For sputter metal, semiconductor and insulation materials
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