D-shape Sputtering Deposition Chamber with front open door for easy inside service
PID downstream and upstream pressure control
Good Film Uniformity and repeatability
Safety interlock for critical components
Configuration
| Magnetron Sputtering chamber | D shape, 304 stainless steel chamber with viewport |
| Vacuum Pumping | turbo-pump (or Cryopump) and dry pump |
| Vacuum Valve | High vacuum gate valves
Chamber Vent Valve, Rough and Foreline angle valve, and gas valve |
| Vacuum Gauging | Wide range vacuum gauge and Pirani rough gauge |
| Sputtering Sources | Up to six 4” circle magnetron sputtering sources
The power supply can be DC, pulse DC or RF power supply |
| Sample Stage | Substrate rotating and heating or cooling |
| Pressure Control | Multiple channel Mass flow controller
Capacitance manometer for sputter process pressure PID control |
| Cooled Water Interlock | Cooling water flow sensors of interlock to protect sputter sources work properly |
Specification
| The Base Vacuum Pressure in Sputter Chamber | better than 3E-8 Torr |
| Sample Loading Capacity | Max. 6 inch flat substrate |
| The Max. Temperature of the Sample Heater | 600C (option 1000C) |
| The film uniformity | better than +/-5% over a rotating 6 inch Silicon wafer |
| General Sputtering Pressure | 1-50mTorr |
Load Lock Unit
| Load Lock Chamber | Base Vacuum Pressure is better than 5E-7 torr
Single or multi substrate loading stage
Option RF plasma cleaning |
